On a daily basis people use appliances that involve highly advanced electronic applications. These remarkably advanced electronic applicances are supported by Hitachi Cable's electronic conponents. We manufacture a wide range of Leadframes, which are used in semiconductor devices such as TAB tape carriers, Electronic Wires and Cables, and Terminal Antenna for Wireless Communication.
We are continually initiating new technology and installing new production lines to produce materials which are in demand such as TAB, ionic plating COL, and LOC in order to contribute to market needs.
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- TAB Products
FPD Field, Semiconductor Package Interposer Field
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LOC (Lead on Chip) Leadframe |
LOC leadframes have revolutionized the miniaturization of IC packages. There are two key factors in reducing an IC package size - miniaturize the IC package by structural techniques or miniaturize a component of the package, namely the chip.
The development of LOC leadframes has had a significant impact on the miniaturization of the IC package by altering the structure of the package from peripheral to center-pad design. This minaturization is possible as the LOC leadframe enables the chip to be bonded onto the pre-taped leadframe eliminating the diepad area.
We have developed and mass-produced LOC leadframes ahead of our competitors and in response to the needs of the worldwide semiconductor industry.
Characteristics
The location of tape attachment is highly precise.
Thermo-plastic tape has a high degree of purity without out-gas.
The center pad design has made miniaturization possible.
Uses
DRAM (4M, 16M, 64M, and 256M)
SRAM (1M, 4M)
Applicable for the IC package assembly of
both large and small chips.
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Terminal Antenna for Wireless Communication |
Internal antenna for mobile phone
Film antenna for wireless LAN
In response to the latest developments of information technology, Hitachi Cable has undertaken intensive research of the terminal antenna for wireless communication
Hitachi Cable first began development of internal antenna as helix diversity antenna for PDC in 1995, and Hitachi Cable produced the internal antenna for GSM & DCS dual band system. Hitachi Cable established the original design technology for the multiple band internal antenna.
In addition to the internal antenna, Hitachi Cable has also started mass production of "Film type antenna" for Wireless communication;IEEE802.11a/b/g and Bluetooth using 2.4GHz and 5GHz band since 2001. The dimension of this antenna is 30mm x 30mm, with a thickness of just 0.2mm. The film antenna can be inserted into the thin and narrow space between parts and covers of mobile devices, like laptop PCs and PDAs, thus reducing the space necessary for mounting of the antenna.
Our terminal antennas have huge potential for being used with various wireless devices and systems because of their small and thin structure, especially for mobile applications. Hitachi Cable is continuously developing the terminal antenna for new and high performance applications.
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