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Hitachi Cable News vol.367
70th semiannual business report From April 1, 2006 to September 30, 2006

 
 



Special Report: Footsteps of Hitachi Cable over 50 years

Proudly announcing our 50th anniversary
since being spun off as an independent company

For 50 years we have pursued diverse communication technologies demanded by the times, in the fields of both information and energy. Under our new corporate vision, we will continue our development in step with society.

 

Hitachi Cable began by producing wires and cables within Hitachi, Ltd. After the company's spin-off in 1956, we developed and mass-produced various leading products of the time, taking advantage of the material processing technology we had cultivated in the manufacture of wires and cables. These products included copper materials, which contributed to technological advances in diverse electronic components, as well as automotive brake hoses, which demand severe quality control. We expanded our business both in the Japanese market and throughout the world. In the 1980s, we developed a range of semiconductor package materials, including dual-gauge copper strips for transistors, LOC lead frames, and TAB tapes. In the 1990s, we developed various types of gallium arsenide epitaxial wafers and other electronic products. In this way we broke into the rapidly growing electronics business. On the other hand, in the field of information networking, we took advantage of our Ethernet* technology, contributing to the establishment of an infrastructure for the broadband era. In 2003, we commercialized "Apresia*," the Ethernet switch series, under our own brand. To expand the business we developed even further, in 2006-on the occasion of our 50th anniversary-we launched our Plan "BEGIN", a new medium-term management plan, and have created a new corporate vision to help set our policy for a new era.

* Ethernet is a registered trademark of Xerox Corporation.
* Apresia is a registered trademark of Hitachi Cable, Ltd. in Japan.
* KOMAKI is a registered trademark of Hitachi Cable, Ltd.
1918
Establishment (Start of production of magnet wires and copper products within Hitachi, Ltd.)
1937 Start of production of power cables and telecommunication cables at the Densen Works
1956
Spin-off from Hitachi, Ltd. as an independent company
1961 Listed on the second section of the Tokyo Stock Exchange and the Osaka Securities Exchange (reappointed to the first section in 1962)
1965
Development of polyamide-imide wires, the mainstream heat-resistant enameled wire
1970 Start of production of high-durability automotive brake hoses
1973
Establishment of ultra-high-voltage CV cable production technology
1980
Delivery of superconductor material for the Fusion Large Coil Task
1983
Development of dual-gauge copper strips for transistors
1988
Development of LOC lead frame
1989
Start of production of TAB tapes, contributing to a multimedia society
1994
Development of gallium arsenide epitaxial wafers for mobile phones
2001
Establishment of J-Power Systems Corp. for high-voltage power cable business
* Established in collaboration with Sumitomo Electric Industries, Ltd.
2003
Start of sales of “Apresia*” Ethernet* switch under the Hitachi Cable brand
2006
50th anniversary since being spun off as an independent company
We launched Plan “BEGIN”, an ambitious medium-term management plan.
We developed Polyamide-imide wires featuring advanced performance based on an earlier line of magnet wires. This technology led to the development of KOMAKI enameled wire, one of the company’s present core products, for high-efficiency motors.
Our brake hoses, developed by taking full advantage of our advanced material processing technology, have gained a high reputation worldwide.
Combining the gas crosslinking method and our unique extrusion technique, we established a production technology for ultra-high-voltage CV cable.
We developed and delivered a large-capacity conductor using an NbTi extra-fine multi-core wire material (for the Japan Atomic Energy Agency, an Independent Administrative Agency).
We hold the leading share in the world market in this area, based on our unique, highly efficient processing methods, tailored to respond to the increasingly demanding semiconductor market.
We initiated a significant breakthrough in miniaturization technology for semiconductor packages.
We began production of TAB tapes, now essential in packaging liquid crystal driving IC and high-end memory .
The use of gallium arsenide wafers is expanding from transmitting and receiving devices such as mobile phones to optical devices such as laser diodes and LEDs.
We have been expanding business with Ethernet technology at the core, including the development of a Gigabit Ethernet* multiplex long-distance transmission device in 2000.
 
 
 
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