Making full use of its technological expertise accumulated in the fields of metal and resin materials and precision processing, Hitachi Cable embarked on a transistor lead frame business in the 1980s. In the early 1990s, we developed an LOC lead frame for space-saving, high-speed memory devices jointly with Hitachi, Ltd. and Texas Instruments, Inc. Since then, we have been working on development and supply of package materials that can accommodate the latest innovations in semiconductor technology, with the cooperation of our customers (chipmakers).
Highly reliable packaging technology for next-generation DRAM: “µBGA®”
To accommodate increasing CPU speed, high-speed DRAM standards including RDRAM®* (Rambus DRAM) and DDR2 SDRAM have been put into practical use in recent years. “µBGA®” is a packaging technology used in these advanced DRAM products. In collaboration with Hitachi, Ltd., we made improvements to the basic structure of Tessera’s µBGA® to enhance its performance. One of the key features of this package is that a cushioning material located between the chip and TAB tape prevents problems caused by temperature or humidity changes, for example, to ensure high reliability and durability. The package’s fine-pitch wiring and low wiring resistance are conducive to high-speed transfer. In addition to design and production of TAB tapes for use in µBGA® packages, we support semiconductor manufacturers at all stages of design, development, prototyping, and production of these packages. We provide package solutions in response to market trends and customer requests.
* RDRAM® is a registered trademark of Rambus Inc.
Paradigm shifts in DRAM package structures
To accommodate increasing LCD resolutions: “COF”
| In recent years, TVs and PCs have been adopting increasingly high-quality/resolution LCD (liquid crystal display) screens. COF (Chip on Film) packaging uses TAB tape technology to bond driver ICs (used to control LCD images) directly to the film without the need for flying leads. Therefore, COF allows even finer-pitch wiring, which contributes to enhancement of LCD image quality. Sales of COF products are rising following rapid growth in the LCD market. |  |
