Ever-evolving DRAM packages
When compared with other types of semiconductor memory, DRAM can deliver higher read/write speed and higher capacity at the same cost. Therefore, DRAM has also been used as the main memory in PCs and servers. To keep pace with the rapidly advancing performance of computers, there has always been a need for higher DRAM speed and capacity. Also, there is now an increasing need for a low-power-consumption and space-saving DRAM for notebook PCs. In response to these needs, semiconductor manufacturers have been trying to improve chip performance through measures such development of fine pitch wiring processes, and cooperating with package material manufacturers in efforts to realize new semiconductor packaging technologies (see “Evolution of DRAM packages”).
Packaging technologies tailored to individual devices
Semiconductor packaging technologies have increased in importance further as a result of adoption of DRAM in various digital and mobile devices. Unlike computers that use DRAM in the form of standard memory modules, these devices require packaging technologies that vary with each device design and specifications. For digital cameras and mobile phones, in particular, a major challenge is how to incorporate high-performance DRAM into the limited space of these increasingly small-sized and light-weight devices. In addition, it is necessary to ensure sufficient reliability and durability of the packages in order that memory performance will not be affected by factors such as temperature and vibration.
With the aim of providing DRAM products according to detailed needs, semiconductor manufacturers are cooperating with end product manufactures and package manufacturers from the design and development stages. To meet the demanding customer needs, they are working on development of new packaging technologies, for example, an ultrathin package with a total thickness of less than 1 mm.
Through such steady progress in technology development, high-speed/capacity DRAM will be adopted by still more digital and mobile devices, and contribute to an increase in their performance and functionality.
Evolution of DRAM packages
Changes in DRAM outer packages, and reduction in their size and weight
