Hitachi Cable News vol.355 June 2004
Hitachi Cable News Vol.354
Back Number  HITACHI Cablenews backnumber
Thanks to Their Slim Dimensions, Large Screens, and High Performance, Demand for Flat Panel Displays is Growing.

Overview | Chapter 1 :Exploding the popularity of flat panel TVs |
Chapter 2 :Structure and feature of FPDs Part1 | Part2 |
Chapter 3 :Expanding FPD market Part1 | Part2 |
Hitachi Cable's products and technologies that contribute to realizing higher performance in FPDs |

Hitachi Cable's products and technologies that contribute to realizing higher performance in FPDs

Semiconductor packaging materials | Copper products | Electronic wires |

Semiconductor packaging materials COF

The image quality and resolution of LCDs have been improving, not only for TV and PC monitor applications but also for use in mobile devices, such as mobile phones and digital cameras. Improvement of LCD performance requires high-precision mounting technology for various electronic components, including panels and driver ICs. Hitachi Cable has applied its microfabrication technology, currently used for TAB tape and other products, to the development of a COF (Chip On Film) technology that enables 25µm-level fine-pitch LCDs. This technology improves LCD manufacturing efficiency. Hitachi Cable continues to develop new technologies to adopt to finer pitches.

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Copper products Rolled copper foil for FPCs

FPCs (flexible printed circuits) are now used in laptop computers and mobile phones, as well as in a wide range of electronic products, ranging from digital cameras to plasma TVs. Rolled copper foil with superb flexibility is a conductive material essential for the production of FPCs. By making the most of the advanced rolling technology it has developed over the years, Hitachi Cable produces a wide array of rolled copper foil products, ranging from standard products with a thickness ranging from approx. 10µm to 35µm to extra-thin products measuring just 8µm to 12µm. Hitachi Cable meets the needs of customers by ensuring a stable supply of high-quality products.

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Copper backing plate

In the sputtering equipment used for the manufacture of LCDs and semiconductors, the backing plate is an important part, serving as a support panel for target materials as well as a heat dissipator. In 2001, Hitachi Cable succeeded in the mass production of copper backing plates using friction stir welding technology, a world first. Compared to conventional methods such as electron beam welding, Hitachi Cable's new method produces minimal distortion in welding, enabling mass production of higher-precision, higher-strength backing plates. By taking advantage of this technology, Hitachi Cable supplies high-quality backing plates for various applications, including large-screen LCDs, semiconductor devices, and CD/DVD media.

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Overview | Chapter 1 :Exploding the popularity of flat panel TVs |
Chapter 2 :Structure and feature of FPDs Part1 | Part2 |
Chapter 3 :Expanding FPD market Part1 | Part2 |
Hitachi Cable's products and technologies that contribute to realizing higher performance in FPDs |

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