The trend toward smaller and thinner devices in telecommunications and other electronic devices used as mobile terminals shows no signs of slowing down. This, combined with a business environment wherein devices become more highly functional and performance increases every year, makes for an exciting and demanding marketplace. Hitachi Cable is responding to the needs of customers and increasing the speed of evolution of electronic devices by providing materials and components for these devices that employ extra-fine and extra-thin processing technologies as well as compound materials that take advantage of advances in nanotechnology.
In this issue of Hitachi Cable Today, we introduce some of the "Smaller, Thinner, Higher Density" products and technologies Hitachi Cable is using to meet the needs of this very demanding marketplace.
Precision Technologies Behind a Wide Range of Electronic Devices
Developing cutting-edge materials for telecommunications and other electronic devices to further increase the speed of miniaturization and increased functionality
Introduction
A mobile phone that can be hidden under a business card or a notebook computer about a centimeter thick...
Electronic devices smaller and thinner than anyone would have believed possible have entered the marketplace due to advances in the fields of miniaturization and thin design as well as higher density of internal components. This was made possible in part by Hitachi Cable products and technologies offering increasing miniaturization and functionality.
If you look around you carefully, maybe even in your pocket, chances are you will find a product with components or materials made by Hitachi Cable.

Click the black letters to get more information
Mobile telephone base station Mobile telephones Notebook computers
High Frequency, Highly Foamed Cables Internal antennas for Mobile Telephones Ultra-fine Coaxial Cables for Transmission of Graphic Data
Multi-Frame Joiners (MFJs)
Film-type Antennas for Notebook Computers
A variety of motors and electrical equipment for automobiles
Heat Resistant Silica Polyimide Enamel Cables
Batteries
Multi-Frame Joiners (MFJs)
Ultra-thin Rolled Copper Foil
Semiconductor package
Chip On Film (COF) module tape for active matrix liquid crystal
High Frequency Wiring Components
Via Filling Base Material


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High Frequency, Highly Foamed Cables Internal antennas for Mobile Telephones Ultra-fine Coaxial Cables for Transmission of Graphic Data Multi-Frame Joiners (MFJs) Film-type Antennas for Notebook Computers Multi-Frame Joiners (MFJs) Ultra-thin Rolled Copper Foil Chip On Film (COF) module tape for active matrix liquid crystal High Frequency Wiring Components Via Filling Base Material